iPhone 18 Series Chip Process and Design Details Revealed: A20 Chip Sticks with N3P, Under-Display Face ID Possible

iPhone 18 Series Chip Process and Design Details Revealed: A20 Chip Sticks with N3P, Under-Display Face ID PossibleA new research report from Jeff Pu, an analyst at TF International Securities, reveals details about the highly anticipated iPhone 18 series. Contrary to previous rumors, the A20 chip will not utilize TSMC's 2nm process

iPhone 18 Series Chip Process and Design Details Revealed: A20 Chip Sticks with N3P, Under-Display Face ID Possible

A new research report from Jeff Pu, an analyst at TF International Securities, reveals details about the highly anticipated iPhone 18 series. Contrary to previous rumors, the A20 chip will not utilize TSMC's 2nm process. Instead, Apple plans to continue using the second-generation 3nm process (N3P), the same process expected for the A19 chip in the iPhone 17 series. This suggests that performance improvements in the iPhone 18 series compared to its predecessor may be relatively modest.

Pu's report further indicates that while the performance boost of the A20 might be less dramatic, Apple will still implement upgrades. These upgrades will primarily focus on optimizing Apple Intelligence features. To achieve this, the A20 chip will employ TSMC's advanced CoWoS (Chip on Wafer on Substrate) packaging technology. This technology allows for tighter integration of the processor, unified memory, and neural engine, improving overall system efficiency and performance, particularly for AI-related tasks.

The use of CoWoS technology indirectly highlights Apple's emphasis on Apple Intelligence features. With the continued growth and expanding applications of AI, Apple needs more powerful chips to meet increasing computational demands. CoWoS technology effectively enhances chip bandwidth and power efficiency, providing stronger support for Apple Intelligence and delivering a smoother, more intelligent user experience. This means that while overall performance improvements in the A20 might be conservative, significant effort is being put into optimizing specific functionalities.

If Pu's predictions are accurate, the first iPhone chip using TSMC's 2nm technology, the A21, won't arrive until the 2027 iPhone. This indicates a relatively cautious approach by Apple regarding chip process upgrades, aligning with their usual strategy of implementing new technologies only after thorough testing and maturation to ensure product stability and reliability. While this might result in less dramatically improved performance compared to competitors in the short term, it minimizes long-term risks and guarantees product quality.

Beyond the chip process, renowned Apple analyst Mark Gurman has also predicted a significant design change for the iPhone 18 Pro series. He suggests that by 2026 or 2027, the size of the Dynamic Island will shrink. This is because Apple plans to move more components under the screen, hinting at the possibility of under-display Face ID as early as the iPhone 18 Pro series.

This technological achievement would revolutionize the design of the iPhone Pro series. The iPhone 18 Pro models might then only feature a single front-facing camera, resulting in a single-hole punch display similar to Android flagships like the Google Pixel 9 and Samsung Galaxy S25. This would significantly improve screen aesthetics and immersion, further enhancing the phone's overall visual appeal.

The implementation of under-display Face ID is not only a breakthrough in full-screen design but also a significant milestone in Apple's biometrics technology. Hiding Face ID under the screen maintains screen uniformity and enhances the phone's overall aesthetic. This technology has been a key area of focus for Android manufacturers; Apple successfully implementing it will further solidify its leading position in the high-end smartphone market.

However, achieving under-display Face ID is not without its challenges, including sensor accuracy, screen transmittance, and power consumption. Apple's ability to pioneer this technology demonstrates its exceptional technological prowess and R&D capabilities, reinforcing its leadership in technological innovation and product design.

Moving more components under the display, besides enabling under-display Face ID, could also offer other advantages, such as a thinner device profile. These subtle improvements will further enhance the user experience, underscoring Apple's dedication to product refinement.

In conclusion, while Jeff Pu and Mark Gurman's predictions remain unconfirmed, available information suggests significant upgrades and improvements for the iPhone 18 series in terms of chip process, Apple Intelligence features, and screen design. Although the overall performance gains of the A20 chip may be conservative, the adoption of CoWoS packaging technology and the potential implementation of under-display Face ID will provide the iPhone 18 series with a significant competitive advantage, further solidifying its position in the high-end smartphone market. These improvements will not only elevate user experience but also propel technological advancements in the smartphone industry. Apple's strategic vision for future technologies warrants continued attention.