Samsung W25 Foldable Phone Imminent: Unimicron HDI Substrate Powers the Release
Samsung W25 Foldable Phone Imminent: Unimicron HDI Substrate Powers the ReleaseIT Home, September 26th - According to Korean media outlet TheElec, small-batch production of components for the Samsung W25 (China) / Galaxy Z Fold Special Edition (Korea) foldable phone is underway, with reliability tests currently in progress. The device is expected to launch this October
Samsung W25 Foldable Phone Imminent: Unimicron HDI Substrate Powers the Release
IT Home, September 26th - According to Korean media outlet TheElec, small-batch production of components for the Samsung W25 (China) / Galaxy Z Fold Special Edition (Korea) foldable phone is underway, with reliability tests currently in progress. The device is expected to launch this October.
The report highlights that the HDI substrate for the Samsung W25 foldable phone is supplied by Unimicron and is being produced at its PCB factory in Beijing. Notably, the phone abandons digital converter technology to reduce thickness and weight but still maintains S Pen support.
HDI Substrate Overview
HDI, or High Density Interconnect, is a technology that utilizes micro blind/buried vias to increase the density of circuit lines on a PCB. In simple terms, HDI substrates enable smaller size and more complex circuit integration, resulting in thinner and lighter electronic products with enhanced functionality.
Unimicron Profile
Established in 1993, Unimicron (formerly Guangzhou Quick Circuit Board Co., Ltd.) specializes in PCB design, manufacturing, and sales. Its products are widely used in communication, consumer electronics, and automotive electronics industries.
In 2022, Unimicron's subsidiary initiated a project to acquire 100% of the shares of Beijing IFE, successfully concluding the acquisition this year. After the acquisition, IFE was renamed Unimicron IFE, becoming a wholly-owned subsidiary of Unimicron. Unimicron IFE is responsible for mass production of the HDI for the Samsung W25 smartphone.
Conclusion
The imminent release of the Samsung W25 foldable phone marks a significant milestone, with Unimicron's HDI substrate playing a crucial role. This launch not only showcases Samsung's continuous exploration in the foldable phone market but also underlines Unimicron's leading position in PCB manufacturing. Looking ahead, Unimicron will continue to provide high-quality HDI substrates for various smartphones and electronic devices, contributing to the rapid advancement of the technology industry.
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