REDMI Turbo 4: Powered by the Dimensity 8400-Ultra, Reshaping the Lightweight Flagship Standard

REDMI Turbo 4: Powered by the Dimensity 8400-Ultra, Reshaping the Lightweight Flagship StandardOn January 2nd, the highly anticipated REDMI Turbo 4 smartphone was officially launched. Equipped with MediaTek's world-first Dimensity 8400-Ultra flagship chip, this phone redefines the lightweight flagship standard with its powerful flagship performance and exceptional energy efficiency

REDMI Turbo 4: Powered by the Dimensity 8400-Ultra, Reshaping the Lightweight Flagship Standard

On January 2nd, the highly anticipated REDMI Turbo 4 smartphone was officially launched. Equipped with MediaTek's world-first Dimensity 8400-Ultra flagship chip, this phone redefines the lightweight flagship standard with its powerful flagship performance and exceptional energy efficiency. REDMI, MediaTek, and Arm joined forces to create this customized Dimensity 8400-Ultra flagship platform. By employing an innovative all-large-core architecture, the REDMI Turbo 4 has revolutionized the mid-to-high-end performance market, changing consumer perceptions of lightweight flagship phones.

The widespread adoption of the all-large-core architecture will allow more users to enjoy high-performance, low-power smartphone experiences. Against the backdrop of rapid advancements in generative AI and 5G technologies, the global smartphone market is thriving, driving continuous innovation and upgrades in mobile chip technology. The Dimensity 8400-Ultra chip is a product of this trend. It not only features the first-ever all-large-core architecture but also boasts comprehensive hardware and software upgrades across the CPU, GPU, NPU, imaging, and communication aspects. It represents MediaTek's largest investment and most advanced technology to date in a lightweight flagship platform.

Positioned as the "All-Large-Core Energy-Efficient Chip," the Dimensity 8400-Ultra represents an unprecedented leap forward in the Dimensity 8 series history. Manufactured using a 4nm process, this chip features the industry's first all-large-core architecture and debuts the new generation energy-efficient large core, the Arm Cortex-A725. It boasts flagship-level L2/L3/SLC super-large cache, and a flagship-equivalent GPU, NPU, and ISP architecture. In real-world tests, the Dimensity 8400-Ultra smoothly handles various mainstream and demanding games, maintaining consistently smooth performance across ten high-frequency daily usage scenarios.

• The Dimensity 8400-Ultra's all-large-core CPU comprises eight Arm Cortex-A725 large cores with a maximum frequency of 3.25GHz, arranged in a "13.25GHz + 33.0GHz + 42.1GHz" configuration. Compared to its predecessor, its CPU single-core performance is improved by 10% with a 35% reduction in power consumption; multi-core performance is boosted by 41% with a 44% reduction in multi-core power consumption. This significant performance boost and power reduction, achieved through precise energy efficiency control technology, allows it to effortlessly handle various daily usage scenarios, including gaming, music playback, video recording, and social interaction, providing users with a more durable and reliable device experience.

The Dimensity 8400-Ultra chip also integrates a flagship-level Mali-G720 MC7 GPU. Its peak GPU performance is 24% higher than the previous generation, with a 42% reduction in power consumption. This GPU supports hardware ray tracing and optimized touch latency, offering users a richer, more immersive visual experience. Whether it's complex game scenes or high frame rate demands, the Dimensity 8400-Ultra handles them with ease, further enhancing graphical processing capabilities.

Beyond the advanced Dimensity 8400-Ultra chip, the REDMI Turbo 4 features several hardware upgrades. It incorporates a 3D ice-sealed circulation cooling pump to effectively reduce operating temperature, ensuring stability during extended high-performance operation. A 1.5K high-brightness display provides a clear and detailed visual experience, while a 6550mAh Xiaomi Jin Sha Jiang battery ensures long-lasting battery life. Furthermore, the REDMI Turbo 4 upgrades to a dual-boost cold-resistant chip, further enhancing overall performance and stability.

To enhance user experience, REDMI Turbo 4 also boasts refined design. Its 2.5D micro-arc frame offers a comfortable grip; the frosted matte glass back cover is not only aesthetically pleasing but also fingerprint-resistant and wear-resistant; and IP68 dust and water resistance further improves durability. These details reflect REDMI's commitment to user experience.

In conclusion, the REDMI Turbo 4, powered by the Dimensity 8400-Ultra's powerful performance and exceptional energy efficiency, along with a series of leading hardware configurations and meticulous design, redefines the lightweight flagship standard. It not only meets the demands for high performance and low power consumption but also delivers an exceptional user experience. The launch of the REDMI Turbo 4 marks a new era for the lightweight flagship market and points towards the future direction of such devices. This phone brings flagship-level performance and a smooth user experience to a wider audience, making high performance no longer exclusive to high-end phones. The success of the Dimensity 8400-Ultra also highlights the remarkable achievements of the collaboration between REDMI, MediaTek, and Arm, setting a new benchmark for future mobile chip technology innovation and development. This collaboration has driven the widespread adoption of the all-large-core architecture, allowing more users to benefit from its high-performance, low-power advantages, injecting new vitality into the smartphone market. The REDMI Turbo 4's success is not only a testament to the product itself, but also a prime example of technological innovation and successful industry collaboration, pointing the way forward for the future of smartphones. Its launch is a significant impact on the lightweight flagship market, reflecting REDMI's continuous pursuit of technological innovation and user experience, providing consumers with a more cost-effective and competitive option. The REDMI Turbo 4's success will further drive the smartphone market towards high performance, low power consumption, and enhanced user experience, bringing a better mobile life to users. The powerful combination of the REDMI Turbo 4 and the Dimensity 8400-Ultra is undoubtedly a highlight of the 2024 smartphone market, and its future market performance and industry impact are eagerly anticipated. This innovative collaborative model also provides valuable experience and guidance for other mobile phone manufacturers, driving progress and development in the entire industry. We expect to see more such strong collaborations in the future, bringing consumers more high-quality smartphone products.