REDMI Turbo 4: Redefining Mid-Range Performance with the Dimensity 8400-Ultra Chip

REDMI Turbo 4: Redefining Mid-Range Performance with the Dimensity 8400-Ultra ChipOn January 2nd, 2025, REDMI officially launched its new flagship phone for the year the REDMI Turbo 4. This phone globally debuts MediaTek's Dimensity 8400-Ultra chip, promising to redefine the performance landscape of mid-range smartphones with its exceptional energy efficiency

REDMI Turbo 4: Redefining Mid-Range Performance with the Dimensity 8400-Ultra Chip

On January 2nd, 2025, REDMI officially launched its new flagship phone for the year the REDMI Turbo 4. This phone globally debuts MediaTek's Dimensity 8400-Ultra chip, promising to redefine the performance landscape of mid-range smartphones with its exceptional energy efficiency. The chip marks a significant breakthrough for MediaTek in the light flagship market, delivering an unprecedented "leapfrog experience" for users.

The Dimensity 8400-Ultra is the world's first sub-flagship chip to utilize a full-large-core architecture. Manufactured using TSMC's advanced 4nm process, it features the new generation energy-efficient Arm A725 cores. The ingenious internal architecture achieves a remarkable balance between performance and power consumption, a key factor in the REDMI Turbo 4's ability to stand out among its competitors.

Full-Large-Core Architecture: The Perfect Fusion of Performance and Efficiency

The Dimensity 8400-Ultra's core innovation lies in its groundbreaking "full-large-core" architecture. Unlike traditional CPU architectures, it abandons the "big.LITTLE" design in favor of eight of the latest A725 large cores. This isn't simply a matter of increasing core count; it involves comprehensive architectural optimization. Doubled L2 cache, a 50% increase in L3 cache, and enhanced system cache significantly improve multitasking efficiency. All CPU cores are equipped with out-of-order execution pipelines, effectively eliminating the performance bottlenecks of smaller cores. This results in a substantial boost in multi-threaded performance without sacrificing Daily Use Time (DoU).

The operating system directly identifies and manages high-performance and high-efficiency cores, dynamically allocating tasks based on actual needs. This intelligent task scheduling ensures smooth operation across various application scenarios, providing users with the optimal experience. This "full-large-core" architecture is the key to the Dimensity 8400-Ultra's breakthrough performance and efficiency. It perfectly blends the latest advancements in Arm CPU architecture with MediaTek's cutting-edge power efficiency technology, bringing about a revolutionary change to the high-end smartphone market.

Flagship-Grade GPU: Smooth Gameplay at High Resolutions

Beyond its powerful CPU, the Dimensity 8400-Ultra incorporates a flagship-level G720 GPU. This isn't just a performance upgrade; it achieves a comprehensive breakthrough in graphics processing capabilities through a 40% bandwidth optimization and significant enhancements to crucial technologies such as multi-sample anti-aliasing, pixel blending output, and texture transfer throughput. Furthermore, the chip supports hardware ray tracing and optimized touch latency, providing users with a richer and more immersive visual experience.

In real-world gaming, the Dimensity 8400-Ultra truly shines. It effortlessly handles both mainstream and graphically demanding games at consistently high frame rates. REDMI showcased test results for several games at the launch event, further demonstrating the chip's impressive performance:

• Honor of Kings (7-hour stress test): Average frame rate of 119.1 fps, maximum temperature of 38.1, and power consumption of only 3.2W.

• Genshin Impact (1.5K high-resolution full-frame rate test): Average frame rate of 59.8 fps, smoothness of 98.6%, and power consumption of 5.3W.

• Honkai: Star Rail: Average frame rate of 54.75 fps, and power consumption of only 7.28W.

These figures clearly indicate that the Dimensity 8400-Ultra not only delivers smooth gaming experiences but also excels in power management, significantly surpassing previous flagship platforms and truly achieving a "leapfrog experience."

REDMI Turbo 4: The Perfect Balance of Performance and Efficiency

The REDMI Turbo 4 fully leverages the Dimensity 8400-Ultra's performance advantages, maintaining consistent smoothness across ten high-frequency daily use scenarios, providing users with an exceptional experience. Whether multitasking or running demanding games, the REDMI Turbo 4 effortlessly handles the workload, showcasing its powerful capabilities.

This phone is not merely a high-performance device; it's a masterpiece that balances performance and energy efficiency. While ensuring smooth operation, it effectively manages power consumption, allowing users to enjoy their phone for extended periods without worrying about battery life.

MediaTek Dimensity Series: Continuous Innovation, Leading the Future

MediaTek's Dimensity series has always been known for its excellent performance and energy efficiency. The launch of the Dimensity 8400-Ultra adds another significant chapter to this legendary series. This chip has not only revolutionized the light flagship smartphone market but also set a new benchmark for other manufacturers. It reaffirms MediaTek's strength in chip research and development and its unwavering commitment to technological innovation. Through continuous innovation and breakthroughs, the MediaTek Dimensity series will continue to lead the future development of smartphone chip technology. The successful launch of the REDMI Turbo 4 heralds a new competitive landscape in the mid-range smartphone market, ultimately benefiting users with superior and more affordable smartphone experiences.