The Pixel 10 series will be powered by the all-new Google Tensor G5 chip: a TSMC 3nm fabrication process with Imagination GPU

The Pixel 10 series will be powered by the all-new Google Tensor G5 chip: a TSMC 3nm fabrication process with Imagination GPUA recent report from AndroidAuthority has unveiled details about Google's upcoming Pixel 10 series, centering around a newly custom-designed Tensor G5 chipset. The report confirms earlier rumors, stating that the Google Tensor G5 will be designed in-house by Google and manufactured by TSMC, the leading semiconductor manufacturer, using their advanced 3nm process a shift from the previous collaboration with Samsung

The Pixel 10 series will be powered by the all-new Google Tensor G5 chip: a TSMC 3nm fabrication process with Imagination GPU

A recent report from AndroidAuthority has unveiled details about Google's upcoming Pixel 10 series, centering around a newly custom-designed Tensor G5 chipset. The report confirms earlier rumors, stating that the Google Tensor G5 will be designed in-house by Google and manufactured by TSMC, the leading semiconductor manufacturer, using their advanced 3nm process a shift from the previous collaboration with Samsung. This change marks a bolder step for Google in the mobile chip arena and suggests significant performance and power efficiency improvements for the Pixel 10 series.

The core architecture of the Google Tensor G5 chipset is based on Arm Cortex CPU cores, consistent with previous Tensor chips. However, the most notable change lies in the GPU selection. Google has moved away from the Arm Mali-G715MP7 used in the Tensor G4, opting instead for Imagination Technologies' IMGDXT GPU. This strategic shift reflects Google's focus on balancing graphics performance and power consumption. The IMGDXT GPU is expected to deliver superior graphics rendering capabilities and lower power consumption, enhancing gaming experiences and overall device battery life.

Beyond the GPU change, the Tensor G5 features a major upgrade in image processing with a fully custom Image Signal Processor (ISP). This marks a significant departure from previous Tensor chips, which relied on modified Samsung ISPs and Google-designed modules. The Tensor G5's completely custom ISP is a first for Google's Tensor chips. Camera performance has always been a core strength of the Pixel series, and this fully custom ISP will provide significantly enhanced image processing capabilities, leading to dramatic improvements in photo and video quality. This is reflected not only in better detail capture and color reproduction, but also in Google's ability to more flexibly optimize the image processing pipeline for superior imaging results. The impact on the Pixel 10 series' camera capabilities is expected to be substantial.

In addition to the GPU and ISP, Google has incorporated numerous other custom designs into the Tensor G5. The chip is expected to feature a custom memory controller for optimized memory access speed and efficiency; a custom system-level cache for faster data access and application responsiveness; and a custom power management unit for more efficient power management and extended battery life. These custom designs demonstrate Google's commitment to creating a highly optimized system-on-a-chip (SoC) to maximize the potential of its hardware platform.

Google has also made adjustments to the multimedia codec capabilities of the Tensor G5. It will abandon the previously used custom BigWave AV1 video codec and Samsung's MFC (Multi-Format Codec), instead adopting Chips & Media's WAVE677DV codec. The WAVE677DV supports encoding and decoding of various video formats including AV1, VP9, HEVC, and H.264, meaning the Pixel 10 series will be able to smoothly play and process a wider range of video content, providing a more comprehensive multimedia experience. This improves video processing efficiency and enhances the compatibility of Pixel devices, allowing them to better adapt to different video content and application scenarios.

It's noteworthy that the Tensor G5 also utilizes third-party components in certain areas. For example, it will employ third-party USB, PCIe, and I3C components, as well as third-party interfaces for DSI (display), DisplayPort, flash memory, and LPDDR5x memory. This indicates a more flexible strategy in Google's chip design, choosing appropriate third-party components to complement its in-house core modules, ensuring performance while also improving design efficiency. This hybrid approach allows Google to focus on the R&D of core technologies and leverage mature third-party technologies to enhance the overall chip performance and stability.

In summary, the numerous changes in the Google Tensor G5 point towards Google's more ambitious goals in the mobile chip market. From the choice of TSMC's 3nm process to the adoption of the Imagination GPU and a fully custom ISP, and the adjustments made to the multimedia codecs, it's clear Google is striving to significantly improve the performance and user experience of its Pixel phones. These improvements are reflected not only in increased computing power, superior graphics rendering, and exceptional camera capabilities, but also in lower power consumption and longer battery life. We can expect the Pixel 10 series, powered by the Tensor G5, to deliver a stunning upgrade to the mobile experience. This chip is not just a testament to Google's technological prowess, but also a proactive exploration of the future direction of mobile devices. By combining in-house design with strategic partnerships, Google is gradually building a more powerful and complete mobile ecosystem. The Pixel 10 series will undoubtedly be a shining star within this ecosystem. Performance improvements will be evident not just in numerical benchmarks, but in every detail of daily usage, resulting in a smoother, more convenient, and efficient user experience. This chip represents another leap forward for Google in mobile chip technology, and signals a future where Pixel phones will possess even stronger competitiveness.