Samsung is actively promoting the fifth generation HBM3e: transmission speed is faster than Hynix, up to 1.228TB/s
Recently, due to the surge in demand for artificial intelligence (AI), the market needs more powerful solutions. Nvidia has decided to advance the release time of the next generation Blackwell architecture GB100GPU from the fourth quarter of 2024 to the end of the second quarter of 2024
Recently, due to the surge in demand for artificial intelligence (AI), the market needs more powerful solutions. Nvidia has decided to advance the release time of the next generation Blackwell architecture GB100GPU from the fourth quarter of 2024 to the end of the second quarter of 2024. At the same time, Nvidia has reached an agreement with SK Hynix to adopt the latter's ultra-high performance DRAM new product HBM3E for artificial intelligence on the new generation B100 computing card.
According to BusinessKorea, Samsung, also a storage powerhouse, has accelerated the development and sales progress of the fifth generation HBM3e "Shinebolt" and is expected to closely follow SK Hynix. After preliminary testing, the maximum data transmission speed of "Shinebolt" will be improved compared to the previous generation, expected to reach 1.228TB/s, which is faster than SK Hynix's HBM3e (with a maximum data transmission speed of 1.15TB/s). At the same time, "Shinebolt" also adopts the latest 12 layer vertical stacking scheme, which can achieve up to 36GB of capacity on a single HBM3e package, while the prototype version uses an 8-layer stacking scheme that only achieves 24GB of capacity. Samsung Electronics' HBM development and production speed still lags behind SK Hynix, and Meguiar has provided customers with test samples of HBM3Gen2 with comparable performance. However, Samsung Electronics is developing a strategy to regain its leading position in advanced storage chip production.
HBM (HighBandwidthMemory) is a high value-added and high-performance product that vertically connects multiple DRAMs, significantly improving data processing speed compared to DRAM. The HBMDRAM product is developed in the order of HBM (first generation), HBM2 (second generation), HBM2E (third generation), HBM3 (fourth generation), and HBM3E (fifth generation), with HBM3E being the extended version of HBM3. HBM is considered the new generation of DRAM in the era of artificial intelligence.
Tag: is Samsung actively promoting the fifth generation HBM3e transmission
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